Ionized physical vapor deposition is a technique for sputtering metal into small trenches, by ionizing sputtered metal atoms so that their trajectories can be controlled by electric fields. To this date no one has quantified exactly what fraction of the metal vapor is ionized, although the trends of how ionization varies with input parameters is known. This article describes and demonstrates a new quartz crystal microbalance design, which can be used to measure the ionized metal flux fraction arriving at the substrate location. Instead of using grids to repel ions as similar devices do, this analyzer works by applying a voltage bias to the front surface of the crystal in order to repel ions. A magnetic field adjacent to the face limits electron current to the microbalance, minimizing its perturbation of the plasma. The measurement tool described in this article does not suffer from complications caused by placing grids in front of the monitor and is an attractive method for characterizing ionized physical vapor deposition systems. Ion and neutral metal fluxes as a function of ionizer power are presented for an argon/copper discharge.