An optimized mixture of polydopamine (PDA) and polyvinyl alcohol (PVA) is employed as the surface functionalizing agent and reducing agent to encapsulate individual polypropylene (PP) fibers of polypropylene micromembrane (PPMM). The functionalized PPMM becomes hydrophilic to allow the formation of Au nuclei for subsequent electroless Au deposition. The metalized PPMM is further deposited with IrO2 nanoparticles, and evaluated as a flexible and porous pH sensor. Images from scanning electron microscope confirms the uniform formation of IrO2 nanoparticles on Au-coated PP fibers. For pH-sensing performance, the IrO2-decorated metalized PPMM reveals a super-Nernstian response for a sensing slope of -74.45 mV/pH in aqueous solutions with pH value ranging between 2 and 12. In addition, the pH-sensing performance is properly maintained after 5000 bending cycles and hysteresis is modest in an acidic environment. The cell viability test indicates a negligible bio-toxicity. Our strategy of using a conductive polymeric membrane decorated with IrO2 nanoparticles enables possible sensing applications in wearable and implantable electronics.

A Na–IrOx(OH)y cell using body fluid as the electrolyte demonstrates large charge storage capacity and long lifetime.

A Cu micromembrane is successfully fabricated and validated as a porous flexible electrode. The Cu micromembrane is prepared by functionalizing individual polypropylene (PP) fibers in a polypropylene micromembrane (PPMM) using a mixture of polydopamine (PDA) and polyethyleneimine (PEI). The mixture of PDA and PEI provides adhesive, wetting, and reducing functionalities that facilitate subsequent Ag activation and Cu electroless plating. Scanning electron microscopy reveals conformal deposition of Cu on individual PP fibers. Porometer analysis indicates that the porous nature of PPMM is properly maintained. The Cu micromembrane demonstrates impressive electrical conductivities in both the X direction (1.04 ± 0.21 S/cm) and Z direction (2.99 ± 0.54 × 10−3 S/cm). In addition, its tensile strength and strain are better than those of pristine PPMM. The Cu micromembrane is flexible and mechanically robust enough to sustain 10,000 bending cycles with moderate deterioration. Thermogravimetric analysis shows a thermal stability of 400 °C and an effective Cu loading of 5.36 mg/cm2. Cyclic voltammetric measurements reveal that the Cu micromembrane has an electrochemical surface area of 277.8 cm2 in a 1 cm2 geometric area (a roughness factor of 227.81), a value that is 45 times greater than that of planar Cu foil.