Kinetic roughening during thin film growth is a widely studied phenomenon, with many systems found to follow simple scaling laws. We show that for Cu electrodeposition from additive-free acid sulphate electrolyte, an extra scaling exponent is required to characterize the time evolution of the local roughness. The surface width w(l,t) scales as t(beta(loc))lH, when the deposition time t is large or the size l of the region over which w is measured is small, and as t(beta+beta(loc)) when l is large or t is small. This is the first report of such anomalous scaling for an experimental ( 2+1)-dimensional system. When the deposition current density or Cu concentration is varied, only beta(loc) changes, while the other power law exponents H and beta remain constant.
Co–Ni–Cu/Cu multilayered nanowires were prepared by electrodeposition using nanoporous aluminum oxide membranes rather than the more usual track-etched polycarbonate membranes as templates. Very large values of the current perpendicular to plane giant magnetoresistance (CPP-GMR) were recorded: 55% at room temperature and 115% at 77 K. The use of aluminum oxide membranes also made possible a study of the effects of annealing on the CPP-GMR.
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