Copper oxide particles of various sizes and constituent phases were used to form conductive circuits by means of photonic sintering. With the assistance of extremely low-energy-density xenon flash pulses (1.34 J/cm2), a mixture of nano/submicron copper oxide particles can be reduced in several seconds to form electrical conductive copper films or circuits exhibiting an average thickness of 6 μm without damaging the underlying polymeric substrate, which is quite unique compared to commercial nano-CuO inks whose sintered structure is usually 1 μm or less. A mixture of submicron/nano copper oxide particles with a weight ratio of 3:1 and increasing the fraction of Cu2O in the copper oxide both decrease the electrical resistivity of the reduced copper. Adding copper formate further improved the continuity of interconnects and, thereby, the electrical conductance. Exposure to three-pulse low-energy-density flashes yields an electrical resistivity of 64.6 μΩ·cm. This study not only shed the possibility to use heat-vulnerate polymers as substrate materials benefiting from extremely low-energy light sources, but also achieved photonic-sintered thick copper films through the adoption of submicron copper oxide particles.

Plasma modification of polyimide (PI) substrates upon which electrical circuits are fabricated by the laser sintering of cuprous oxide nanoparticle pastes was investigated systematically in this study. Surface properties of the PI substrate were investigated by carrying out atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS), and contact angle measurements. Experimental results show that surface characteristics of PI substrates, including surface energy, surface roughness, and surface binding significantly affected the mechanical reliability of the sintered copper structure. Among the plasma gases tested (air, O2, Ar-5%H2, and N2-30%H2), O2 plasma caused the roughest PI surface as well as the most C=O and C–OH surface binding resulting in an increased polar component of the surface energy. The combination of all those factors caused superior bending fatigue resistance.

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