With the rapid development of integrated circuit technology, the heat flux of electronic chips has been sharply improved. Therefore, heat dissipation becomes the key technology for the safety and reliability of the electronic equipment. In addition, the electronic chips are distributed discretely and used periodically in most applications. Based these problems, the characteristics of the heat transfer performance of flow boiling in parallel channels with discrete heat source distribution are investigated by a VOF model. Meanwhile, the two-phase flow instability in parallel channels with discrete heat source distribution is analyzed based on a one-dimensional homogeneous model. The results indicate that the two-phase flow pattern in discrete heat source distribution is more complicated than that in continuous heat source distribution. It is necessary to optimize the relative position of the discrete heat sources, which will affect the heat transfer performance. In addition, compared with the continuous heat source, the flow stability of discrete heat sources is better with higher and lower inlet subcooling. With a constant sum of heating power, the greater the heating power near the outlet, the better the flow stability.

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