This article presents a novel method to provide whole Deep Trench (DT) profile inspection. Bevel angle top-down polishing is used on pre-rotated substrates instead of traditional cross-section cleaving. This method can feedback the precise DT profile shape at specific depths to the production line for process tuning and troubleshooting.

This paper demonstrates a novel method of XTEM sample preparation for site-specific surface defect analysis using backside polishing. Analysis of three different types of site-specific surface defects was demonstrated using a novel backside XTEM sample preparation method. The details of the backside XTEM sample preparation method and some examples are reported in this paper. Comparing to Auger electron spectrometry (AES) results on similar defects, more detailed and precise information is observed using TEM analysis with this method. It is therefore a complementary technique to traditional AES analysis on surface defects for contamination with atomic level concentration. From the results, the sample preparation method can produce a clean, pristine surface that is well characterized and could be reproduced, successfully.