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This paper reports the peel strength and surface morphology of a Cu/Ni/PI structure flexible copper clad laminate (FCCL) based on polyimide (PI) according to the preprocessing output (plasma power). Field emission scanning electron microscopy (FESEM), X-ray diffraction (XRD), and X-ray photoelectron spectroscopy (XPS) were used to analyze the surface morphology, crystal structure, and interface binding structure, respectively, of sputtered Ni, Cu, and electrodeposited copper foil layers. The surface roughness of the Ni and Cu sputtered layers and the crystal structure of the electrodeposited Cu layer changed according to the preprocessing output of PI. In the case of 200W preprocessing versus non-plasma processed groups, XPS showed increases in C-O and C=O bonding fractions. In addition, the non-plasma processed case showed a very low peel strength of 3.57 gf/mm, which was improved approximately three-fold to 10.5 gf/mm by plasma preprocessing. Considering the change in FWHM, which provides an estimate of the changes in the crystal structure of the deposited layers as well as those of the peel strength and plastic strain, the optimal preprocessing plasma power was estimated to be approximately 200 W.

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