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Wood polymer nanocomposites were prepared from solid aspen wood, water-soluble melamine-urea-formaldehyde (MUF) resin, and silicate nanoclays. The nanofillers were ground with a ball-mill before being mixed with the MUF resin and impregnated into the wood. The water-soluble prepolymer was mixed with the nanoclays at a mixing speed of 3050 rpm for 20 min to form impregnation solutions. Wood was impregnated with resin, which polymerized in situ under certain conditions. The physical and mechanical properties of the composite and the effect of ball-milling treatment of nanofillers on these properties were investigated. Significant improvements in physical and mechanical properties, such as density, surface hardness, and modulus of elasticity, were obtained for specimens impregnated with MUF resin and nanoclay-MUF resin mixtures. Ball-mill treatment favors dispersion of the nanofillers into the wood, but also appears to interfere with particle-resin adhesion.

The influence of the surface chemistry of the cellulose fiber and polymer matrix on the mechanical and thermal dynamic mechanical properties of cellulose‐fiber‐reinforced polymer composites was investigated. The cellulose fiber was treated either with a coupling agent or with a coupling‐agent treatment followed by the introduction of quaternary ammonium groups onto the fiber surface, whereas the polymer matrix, with opposite polar groups such as polystyrene incorporated with sulfonated polystyrene and poly(ethylene‐co‐methacrylic acid), was compounded with the fiber. The grafting of the fiber surface was investigated with Fourier transform infrared spectroscopy and X‐ray photoelectron spectroscopy. Experimental results showed that an obvious improvement in the mechanical strength could be achieved for composites with an ionic interface between the fiber and the polymer matrix because of the adhesion enhancement of the fiber and the matrix. The improved adhesion could be ascribed to the grafted ionic groups at the cellulose‐fiber surface. © 2003 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 41: 2022–2032, 2003