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Thermal Fatigue of flip chip component solder joints is widely existing in thermal energy systems, which imposes a great challenge to operational safety. In order to investigate the influential factors, this paper develops a model to analyze thermal fatigue, based on the Darveaux energy method. Under cyclic thermal loading, a theoretical heat transfer and thermal stress model is developed for the flip chip components and the thermal fatigue lives of flip chip component solder joints are analyzed. The model based simulation results show the effects of environmental and power parameters on thermal fatigue life. It is indicated that under cyclic thermal loading, the solder joint with the shortest life in a package of flip chip components is located at the outer corner point of the array. Increment in either power density or ambient temperature or the decrease in either power conversion time or ambient pressure will result in short thermal fatigue lives of the key solder joints in the flip chip components. In addition, thermal fatigue life is more sensitive to power density and ambient temperature than to power conversion time and ambient air pressure.

Based on the volume of fluid (VOF) method, a numerical model of bubbles splitting in a microfluidic device with T-junction is developed and solved numerically. Various flow patterns are distinguished and the effects of bubble length, capillary number, and diameter ratio between the mother channel and branch are discussed. The break-up mechanism is explored in particular. The results indicate that the behaviors of the bubbles can be classified into two categories: break-up and non-break. Under the condition of slug flowing, the branches are obstructed by the bubbles that the pressure difference drives the bubbles into break-up state, while the bubbles that retain non-break state flow into an arbitrary branch under bubbling flow condition. The break-up of the short bubbles only occurs when the viscous force from the continuous phase overcomes the interfacial tension. The behavior of the bubbles transits from non-break to break-up with the increase of capillary number. In addition, the increasing of the diameter ratio is beneficial to the symmetrical break-up of the bubbles.

A two-dimensional molecular dynamics model of the liquid flow inside rough nanochannels is developed to investigate the effect of a solid wall on the interface slip of liquid in nanochannels with a surface roughness constructed by rectangular protrusions. The liquid structure, velocity profile, and confined scale on the boundary slip in a rough nanochannel are investigated, and the comparison of those with a smooth nanochannel are presented. The influence of solid wall properties, including the solid wall density, wall-fluid coupling strength, roughness height and spacing, on the interfacial velocity slip are all analyzed and discussed. It is indicated that the rough surface induces a smaller magnitude of the density oscillations and extra energy losses compared with the smooth solid surface, which reduce the interfacial slip of liquid in a nanochannel. In addition, once the roughness spacing is very small, the near-surface liquid flow dominates the momentum transfer at the interface between liquid and solid wall, causing the role of both the corrugation of wall potential and wall-fluid coupling strength to be less obvious. In particular, the slip length increases with increasing confined scales and shows no dependence on the confined scale once the confined scale reaches a critical value. The critical confined scale for the rough channel is larger than that of the smooth scale.