QFN (Quad Flat No-lead) packages become popular in recent years because they provide many advantages over conventional leadframe packages.Due to CTE (Coefficient of Thermal Expansion) mismatch of different materials applied in the package, significant warpage will be generated during QFN packaging process, and may cause yield and reliability issues. In this paper, the warpage of a QFN strip induced by molding process was simulated using finite element analysis (FEA). Effect of stress relief slots design of the leadframe was evaluated, and the influence of material properties was also studied with three different types of EMC (Epoxy Molding Compound). Simulation results indicated that CTE of the EMC had a considerable effect on the warpage direction and magnitude, and the existence of stress relief slots only slightly reduced warpage magnitude.

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