Effect of multiwalled carbon nanotubes in thermal conductivity of an immiscible blend of polyamides, 50/50 (wt%/wt%) polyamide 12/polyamide 6, was analyzed as function of nanofiller amount and temperature. Effect of the molding temperature in the structure of conductive network was investigated by rheology. Data show that 5 vol% multiwalled carbon nanotubes caused an increase of 41% in thermal diffusivity and 78% in thermal conductivity respect to polyamide blend values. Thermal conductivity improvement could be described by percolation theory, with a low threshold composition (φc = 0.09 vol% carbon nanotube). Fitting parameters obtained from Agari’s adjustment model show that polyamides structure is not affected by carbon nanotubes and the nanofillers can easily form conductive paths in the polyamide 12/polyamide 6 matrix. The temperature increase facilitates nanofiller dispersion causing the formation of a denser carbon nanotube network and rising the thermal diffusivity of carbon nanotube composites with low percolation level, as was proved on annealed samples at 255℃.

Biodegradable films based on poly(lactic acid) blends were obtained by cast extrusion. Their tensile and fracture behavior was investigated and the effect of the processing conditions through the extrusion rolling speed on this behavior was analyzed. In uniaxial tensile tests, all films presented completely ductile behavior exhibiting a defined yield point, strain softening after this point and a plateau before fracture. Fracture behavior was determined through quasi-static fracture tests on deeply double edge notched tensile specimens. The film obtained at the lowest rolling speed exhibited completely ductile behavior hence, the Essential Work of Fracture methodology was applied to characterize its fracture. The film processed at intermediate rolling speed, on the other hand, presented ductile fracture or ductile instability depending on the ligament length and the film obtained with the highest rolling speed exhibited a transition regime fracture. In order to compare the fracture behavior of the different films, the J-integral at maximum load J max was adopted. Differences in the films fracture behavior were correlated to the processing-induced morphology.

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