N-doped diamond-like carbon (DLC) films were deposited on Si substrates by pulsed laser deposition (PLD) at varying N 2 pressure. The films were characterized by Raman spectroscopy and X-ray diffraction (XRD). Spectra show that the sp 2 hybridized carbon content increases with increasing N 2 pressure and that the films have a mainly amorphous structure. The residual stress of the films is reduced from 31.8 to −2.2 GPa by N-doping at appropriate N 2 pressure. Diamond-like carbon (DLC) films have many superior properties, including mechanical hardness, dielectric strength, chemical inertness, low coefficient of friction, and optical transparency in the infrared ranges, making them promising for a wide range of applications [1,2]. They can be synthesized by a variety of methods, including pulsed laser deposition (PLD) [2,3] and, under some conditions, filtered cathodic vacuum arc (FCVA) deposition [4]. DLC properties approach those of crystalline diamond. However, the films have very high intrinsic stress [5,6] and consequently tend to exhibit low adhesion with increased thickness [5,6], thus severely limiting their practical applications.Alloying amorphous carbon (a-C) films with transition metals such as Ni, Co, Ti, Mo, and W is a common strategy for reducing residual stress in DLC films [7]. The effects of dopants such as B, P, and N on the microstructure, electrical structure, and mechanical and optical properties of a-C films have been studied. However, there has been no extensive study on the effect of nitrogen concentration on the properties of N-doped DLC films.In this work, we prepared N-doped DLC films by PLD at varying N 2 pressure. We then investigated the structure and residual stress of the films by Raman spectroscopy and X-ray diffraction (XRD).N-doped diamond-like carbon films were deposited on Si wafers by PLD at room temperature. The distance between target and substrate was 4 cm. The excimer laser energy density was 7.5 J/cm 2 . Nitrogen pressure was in the range 8-20 × 10 −3 Pa.The crystal structures and residual stresses of the films were determined by X-ray diffraction (X Pert PRO) us-