The morphology, stress, and composition distributions of the crosshatch pattern on a SiGe film grown on a Si͑001͒ substrate using a low-temperature Si buffer are studied by atomic force and Raman microscopies. Crosshatching is not related to composition fluctuation regardless of the stress undulation associated with strain relaxation in the SiGe film. The crosshatch morphology arises from vertical lattice relaxation induced by piled-up misfit dislocations in the Si buffer layer and substrate. A model for crosshatch formation is proposed.

Relaxed GexSi1−x epilayers with high Ge fractions but low threading dislocation densities have been successfully grown on Si (001) substrate by employing a stepped-up strategy and a set of low-temperature GeySi1−y buffers. We show that even if the Ge fraction rises up to 90%, the threading dislocation density can be kept lower than 5×106 cm−2 in the top layers, while the total thickness of the structure is no more than 1.7 μm.