A bonding technique that makes use of silver oxide particles with a reducing agent was developed for a high-temperature environment. The silver oxide particles are reduced using a reducing agent at 150°C, and the sintering of the silver nanoparticles which are produced occurs at this temperature. To investigate the reliability of the bond layer formed by the sintered silver, a power cycling test was performed on the module. The module survived more than 75,000 power cycles in a test with T jmax = 150°C (ΔT j = 120 K) while the number of cycles to failure for a soldered (Pb3.5Sn1.5Ag) power device didn't exceed 25,000 cycles. This result shows that the sintered silver bonding technique could be used to increase the lifetime of the power module by eliminating the solder layer.
The AL-0.5 wt.% Cu-1 wt.% SipiW interface reaction due to thermal treatments in nitrogen was investigated using SIMS, x-ray difkaction (XRD), TEM, XPS and SEM. Titanium starts to d i m into the A1 alloy layer at low temperatures such as 350 "C. However, Ti has hardly any effect on the sheet resistance. Tungsten diffuses and reacts with A1 above 450 "C. The rugged interfacial reaction product formed after annealing at 450 "C, which may be W(A1, Si)*, does not affect the sheet resistance. The needle-shaped reaction product formed after annealing above 50O0C, which is AI,,W, is responsible for the large increase in sheet resistance. An aluminium oxide layer, several nanometres thick, formed on the Al alloy surface after annealing at 500 "C acts as a W diffusion barrier.
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