Polymer matrix composites (PMCs) may be found in nearly every facet of modern society, from electronic components to a broad range of accessories. Polymer matrix composites contain materials that include a matrix polymer. It is also made up of multiple continuous and short fibres that are held together in the organic polymer matrix. In this article, the development, properties, and production of polymer matrix composites along with electronics applications were discussed. The matrices in recent developments of polymer matrix composites have been made of thermosets or thermoplastic materials. The properties of a PMC such as a matrix and reinforcement offer great strength and rigidity, and it is largely employed to increase fracture toughness. The process of manufacturing composites has a significant impact on the product design and outcome. The ability to make a product from a variety of manufacturing techniques is unique to the composites industry. Polymer-based materials were employed in a variety of applications, including the automobile industry, aircraft industry, marine, sports good equipment, electronics applications, and biomedical applications. The great potential of filler reinforced polymer composites used for microelectronic applications. Woven glass fibre cloths and reinforcing materials such as paper, glass fibre matte, and fillers are used to fabricate printed circuit boards. Thermoplastics and thermosets are used in electronic packaging material which increases efficiency and offers more stringent requirements. Polymer composites have good thermal conductivity and desirable dielectric properties which improves microelectronic performances. Nanocomposites are composites in which nanofillers were distributed inside a polymer. The compatibility and interface between the filler and matrix play a significant effect in modifying overall characteristics in polymer nanocomposites.

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The polycrystalline bulk samples of R0.67Sr0.33MnO3 (R = Pr, Nd, Gd) were prepared by solid state reaction method and characterized by powder X-ray diffraction. The room temperature elastic behavior of these materials was investigated by employing ultrasonic pulse transmission technique at 1 MHz. The values of elastic constants were computed from longitudinal and shear velocities. The measured values were corrected to zero porosity using Hasselman and Fulrath's formulae. The variation of elastic moduli with the size of rare earth ion is interpreted in terms of strength of interatomic bonding.