A p-nitrophenyl-alpha-D-glucopyranoside-hydrolyzing oligo-1,6-glucosidase of Bacillus coagulans ATCC 7050 (facultative thermophile) was purified to homogeneity. The relative molecular mass, Stokes radius, sedimentation coefficient at 20 degrees C in water, molecular absorption coefficient at 280 nm and pH 6.8, and isoelectric point were estimated as 60 000, 3.29 nm, 4.8 X 10(-13) s, 1.34 X 10(5) M-1 cm-1, and 4.3, respectively. The amino-terminal amino acid was threonine. There was no common antigenic group between the enzyme and each of its homologous counterparts from Bacillus cereus ATCC 7064 (mesophile) and Bacillus thermoglucosidasius KP 1006 (obligate thermophile). These oligo-1,6-glucosidases strongly resembled one another in their amino acid composition, except that the proline content increased with the elevation of thermostability in the order, mesophile----facultative thermophile----obligate thermophile enzymes.

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A new chip scale package (CSP) using an organic laminated substrate called CSP was developed, which was fabricated using ALIVH substrate as a interposer and stud-bumpbonding (SBB) flip-chip technology. The ALIVH substrate is a multilayered organic substrate with inner via holes in any layer. The newly developed CSP-L using ALIVH substrate had realized a miniaturization of its package size same as a CSP using a ceramic substrate (CSP-C). In order to perform the SBB flipchip bonding onto the ALIVH substrate, an excellent coplanarity of the substrate surface was required. The required coplanarity was obtained using a fixture during the SBB flip-chip bonding process. The first-level packaging reliability and the second-level packaging reliability onto ALIVH mother board were evaluated. The resulting reliabilities were good enough to apply to the practical use.

technique for high density Multi-Chip-Module (MCM), using called Stud-Bump-Bonding (SBB) technique, which can bond bare LSI chips directly to ceramic substrate. Au bump is formed on electrode pad of LSI chip by a wirebonding apparatus. Each Au bump has two-stepped construction and bonded with a conductive adhesive to an electrode terminal formed on the ceramic substrate. The conductive adhesive is very flexible and strong in bond, thus resisting thermal and mechanical stresses. Moreover, repair technique has been developed. 100 ,u m pitch electrode pads of LSI chip can be bonded to electrode terminals. The bonding resistance is less than 50 m i l . memory module. High density and reliability in bonding for MCM have been attained by the SBB technique. We have developed advanced flip-chip bonding We have applied the SBB technique to high density MCM for

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