Annealed pyrolytic graphite (APG) is a material with thermal conductivity of about 1500 W/(m·K). This property may enable the usage of APG’s thermal potential to develop highly thermally conductive composites for devices requiring effective thermal management. In this paper, APG has been encapsulated in aluminum by brazing, and the thermal properties of Al-APG composite baseplates were measured. The results show that the thermal conductivity of the Al-APG composite baseplates is about 620 W/(m·K), which is four times higher than the pure aluminum plate (152 W/(m·K)).

Copper-aluminium composite heat dissipation components have both the high thermal conductivity of copper and the low density of aluminium. Copper and aluminium are dissimilar materials as they have significant differences in physical and chemical properties, and hence it is not easy to weld them together. In this paper, the joining of copper to aluminium is studied by using the ultrasonic brazing technique. The results show that the copper and aluminium can be connected by ultrasonic brazing, and it is found that the bonding of the copper side interface is the weak link of the entire joint, but the joint strength can still reach 95MPa.

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