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After technical results presented the last two years and new results on volatile contamination, this paper reviews the contamination management in advanced microelectronic and proposes rules for advanced Integrated Circuits (IC) manufacturing. The competitiveness of a production line is insured only if right contamination management rules are applied. These rules must allow a fast introduction of disruptive technologies while keeping as low as possible associated costs: processing on shared equipments, determination of acceptable levels of contamination with a good understanding of their detrimental impact on devices, knowledge on contamination dissemination mechanisms. Moreover, a control of contamination using appropriate cleanings and metrologies is mandatory.