No abstract

Cu-ion-migration-induced the porous low-k dielectric breakdown was studied in alternating polarity-bias conditions using a metal–insulator–metal (MIM) capacitor with Cu as a top metal electrode. The experimental results indicated that Cu ions migrate into a dielectric film under a positive polarity stress, leading to a shorter time to failure (TTF). Additionally, the TTF obtained in the alternating-polarity test increased with decreasing the stressing frequency, indicating that the backward migration of Cu ions during the reverse-bias stress. When the frequency is decreased to 10-2 Hz, the measured TTFs were higher as compared to a direct-current (DC) stress condition. Under Cu-ion-recovery case, the electric-field acceleration factor for porous low-k dielectric film breakdown tends to increase. Meanwhile, this Cu backward migration effect is effective as the stressing time in the negative polarity is larger than 0.1 s.

This paper uses the information on the Xijiang floating production storage and offloading mooring system coupled with dynamic analysis of the system to generate scenarios for the most likely causes of the damage to the wires and if this is likely to result in further progressive damage of the mooring system. The modeling reflects the fundamentals of the Xijiang FPSO mooring system and can be used to further investigate potential causes for the mooring leg damage. The mooring dynamic analysis has been used to investigate the indicative behavior of the mooring lines under various conditions when BTM connected. The model has been used to investigate the tensions, bending moments and bending radiuses close to the lower socket. However the models have been checked to determine that they produce results which are of the correct order for the mooring system.