We realized two diamond microdevices: a movable diamond microgripper and a diamond probe for an atomic force microscope (AFM), consisting of a V-shaped diamond cantilever and a pyramidal diamond tip, using a microfabrication technique employing semiconductive chemical-vapor-deposited diamond thin film. The microgripper was fabricated by patterning diamond thin film onto a sacrificial SiO 2 layer by selective deposition and releasing the movable parts by sacrificial layer etching. The diamond AFM probe was fabricated by combining selective deposition for patterning a diamond cantilever with a mold technique on an Si substrate for producing a pyramidal diamond tip. The cantilever was then released by removing the substrate. We report the initial results obtained in AFM measurements taken using the fabricated diamond probe. These results indicate that this diamond probe is capable of measuring AFM images. In addition, we have developed the anodic bonding of diamond thin film to glass using Al or Ti film as an intermediate layer for assembly. This bonding technique will allow diamond microstructures to be used in many novel applications for microelectromechanical systems. [397]Index Terms-Diamond AFM probe, diamond film, diamond microstructures, MEMS, micromachining.

We have developed an ultraprecision machining system with an in situ STM function. For this purpose, we have made a semiconductive diamond probe of sufficient hardness to prevent deformation or damage occurring during machining and with a tunnel-current-detecting capability for the fabrication of three-dimensional nano-structures in any material, independent of hardness. In order to realize this system, we first constructed a high-resolution driving system with two single-tube three-dimensional piezoelectric devices as scanners. Test measurements with a conventional tungsten probe showed that this driving system could obtain STM images with a resolution of about 20 nm. Next, we developed a CVD molding technique for fabrication of the semiconductive diamond probe. A mold with a 70 µm × 70 µm square pyramidal pit was formed by anisotropic etching of (001)Si in potassium hydroxide (KOH) solution. Then, a semiconductive diamond thin film was deposited onto the pyramidal mold using hot-filament CVD. After removing the mold by wet etching, the resulting pyramidal diamond probe had a facial angle of 70.6 • and a tip radius of about 70 nm. In order to test the applicability of this semiconductive diamond probe, we machined polished Si (a typical hard-to-cut material) to form nano-scale grooves and square recesses, and then measured those machined structures in situ using the three-dimensional driving system. The results showed that this newly developed semiconductive diamond probe was effective both as a machining tool and as an STM probe.

AFM probes consisting of a diamond cantilever and a diamond tip were fabricated using a newly developed micromachining process based on the CVD ofdiamond film. The tips were fabricated by diamond deposition onto a Si mold formed by anisotropic etching in a KOH solution. It was possible to realize a sharp diamond tip with an apex radius of less than several tens of nm. The cantilevers were fabricated by selective deposition of diamond film patterns. This process was realized by mechanically damaging the substrate surface and subsequent pattern etching of the damaged layer, leaving a damaged pattern of high nucleation density on the substrate surface. Finally, the base of the fabricated diamond probe was coated with an Al layer by evaporation and then attached to a glass backing plate with epoxy adhesive to facilitate handling.We also discuss the possibility of attaching the glass backing plate by anodic bonding to further increase accuracy.Applying the fabricated V-shaped and rectangular diamond probes to measurements on a commercial AFM system, it was demonstrated that theywere capable of obtaining AFM images.