No abstract

A series of PT-EP composite materials under different imidization temperature gradients were prepared from 3,3' -diethyl-4,4' -diamino diphenyl methane (DEDA DPM), benzop-henone tetracarboxylic acid dianhydride (BTDA) and epoxy resin (E-51), and thermal imide process was used. Fourier transform infrared spectroscopy (FI-TR) indicated that the chemical reactions between poly(amic acid) and epoxy resin was existence and imide ring had formed. Heat-resistant property, dielectric property and mechanical property of PT-EP composite materials were tested, respectively. The results showed that the order of the materials heat resistance was 493 K> 523 K > 473 K> 453 K, dielectric constant and dielectric loss were ranged from 3.30�3.68 and 1.2xlO-3 �1.3xl0-2 , the shear strength of PT-EP-493 K was the best and attained maximum value 8.962 MPa, the adhesive forces of all composite materials were at the higher level (one or two level), fully met the applied requirement.In the past three decades, polyimide was well known as high thermal stability, excellent mechanical prop erties, good chemical resistance and low dielectric constant. Therefore it had been widely utilized for the microele-ctronic industry such as the semiconductor integrated circuit \IC/ packaging and buffer coating layer applications 1 -2 .The epoxy resin had excellent adhesive ability, good mechanical properties, admir able mixing, epoxy adhesives for most inorganic non metallic materials, metal materials and polar polymer materials were strong adhesive, but heat resistance was not high and electrical performance also could not meet the requirement of high performance mater ials [ 31 . In order to develop comprehensive properties, in this paper the intermediate of poly imide (PAA) and epoxy resin (E-51) blended and then used thermal imidization method to prepare P[-EP composites. And the mechanical properties, thermal stability and dielectric loss, dielectric constant of composites were investigated, provided experimental data and theoretical basis for the development and application of high performance insulating varnish and adhesive.