In this research, a regioregular poly (3-alkylthiophene) derivative had been synthesized via the post-polymerization functionalization, poly (3-hexylamine thiophene), which are soluble in water and water miscible solvents such as methanol, DMSO. The suitable energy level, good thermal stability and water/alcohol solubility of polymers which promising applied in polymer solar cells and processed by water or environmental-friendly solvents. In blend of functionalization polymers and fullerene derivative potassium [6,6]-phenyl-C61-butyrate shows significant UV absorption decay phenomenon and occur precipitates follow with time increase. To further investigate the mechanism of composite, FT-IR analysis and TEM investigate were used, the polymer would be bonded with carboxyl of fullerene derivative via hydrogen bonding in the carboxyl region and TEM images demonstration the mixture that be able to self-assembly a interpenetrating network composite.

This study investigated the impact of material properties of epoxy molding compounds on wafer warpage in fan-out wafer-level packaging. As there is currently a lack of comprehensive discussion on the various material property parameters of EMC materials, it is essential to identify the critical influencing factors and quantify the effects of each parameter on wafer warpage. The material properties include Young’s modulus of the epoxy molding compound before and after the glass transition temperature (Tg) range of 25–35 °C (EL) and 235–260 °C (EH), coefficient of thermal expansion (α1, α2), and the temperature change (∆T) between EL and EH. Results show that, within the range of extreme values of material properties, EL and α1 are the critical factors that affect wafer warpage during the decarrier process in fan-out packaging. α1 has a more significant impact on wafer warpage compared with EL. EH, α2, Tg, and ∆T have little influence on wafer warpage. Additionally, the study identified the optimized material property of the epoxy molding compound that can reduce the maximum wafer warpage in the X and Y directions from initial values of 7.34 mm and 7.189 mm to 0.545 mm and 0.45 mm, respectively, resulting in a reduction of wafer warpage of 92.58% (X direction) and 93.74% (Y direction). Thus, this study proposes an approach for evaluating the impact of material properties of epoxy molding compounds on wafer warpage in fan-out wafer-level packaging. The approach aims to address the issue of excessive wafer warpage due to material variation and to provide criteria for selecting appropriate epoxy molding compounds to enhance process yield in packaging production lines.