This paper describes a low-power 1.2 V 8-bit 1Gs/s two-channel pipeline ADC. The novelty of the designed ADC lies in: ameliorating the two-channel pipeline structure that consists of 1.5-bit multiplying DAC (MDAC). In order to reduce the power consumption and improve the sampling speed, the dual-channel pipeline Time Division Multiplexing operation amplifier and double or single channel flash ADC are used; in the front-end Sample-and-Hold circuits, switch-linearization control circuits(SLC) driven by a single clock signal is applied to solve the problem of time-skew and time mismatch between two channels. The pipeline ADC is designed with 90 nm CMOS process. From the simulation results of the designed ADC, we can draw that the SFDR is 42.3 dB; the SNR is 32.7 dB under the usual temperature. The ADC achieves 21 mW power-dissipation, 8 resolution and 1.01 GS/s sampling speed. So the design meets high speed, high precision and low power dissipation at the same time.

The negative effect of the conventional laser bonding caused by high temperature has been analyzed in the Si-glass bonding process. A new method which is the combination of chip surface activated pre-bonding and laser bonding has been proposed. The method has been used for Micro Electro Mechanical System package experiment. The process is: firstly, a hydrophilic surface was formed by using a special chemical method. Secondly, Si and glass were pre-bonded at room temperature. Finally, the laser with the wavelength of 1.070 μm, spot diameter of 480 μm, power of 70 W was local heated by the laser. This method achieves low-temperature bonding without external press. And the tensile test also shows that the strength of sample bonding reaches 2.8 MPa~3.2 MPa. So it not only ensures the quality of MEMS chip, but also reduces the cost of the package.