No abstract

In order to improve osseointegration of dental implants with bone we studied an implant with holes inside its body to deliver bioactive materials based on a proposed patent. Bioactive materials can be selectively applied through holes to a patient according to diagnosis and the integration progress. After the bioactive material is applied, bone can grow into the holes to increase implant bonding and also enhance surface integration. In order to improve the concept and study the effect of bioactive material injection on implant integration, design optimization and integration research were undertaken utilizing the finite element method. A 2-dimensional simulation study showed that when bone grew into the holes after the bioactive material was injected, stress vertically distributed in the upper part of the implant was relieved and mild stress appeared at the opening of the injection holes. This confirmed the effect of the bioactive material and the contribution of the injection holes, but the maximum stress increased ten-fold at the opening. In order to reduce the maximum stress, the size, location, and the number of holes were varied and the effects were studied. When bioactive materials formed an interface layer between the implant and the mandible and four holes were filled with cortical and cancellous bones all the stress concentrated opposite to the loading side without holes disappeared. The stresses at the four outlets of the holes was mildly elevated but the maximum stress value was ten-fold greater compared to the case without the bioactive material.

The effects of post-CMP cleaning on the chemical and galvanic corrosion of copper (Cu) and titanium (Ti) were studied in patterned silicon (Si) wafers. First, variation of the corrosion rate was investigated as a function of the concentration of citric acid that was included in both the CMP slurry and the post-CMP solution. The open circuit potential (OCP) of Cu decreased as the citric acid concentration increased. In contrast with Cu, the OCP of titanium (Ti) increased as this concentration increased. The gap in the OCP between Cu and Ti increased as citric acid concentration increased, which increased the galvanic corrosion rate between Cu and Ti. The corrosion rates of Cu showed a linear relationship with the concentrations of citric acid. Second, the effect of Triton X-100 ® , a nonionic surfactant, in a post-CMP solution on the electrochemical characteristics of the specimens was also investigated. The OCP of Cu decreased as the surfactant concentration increased. In contrast with Cu, the OCP of Ti increased greatly as this concentration increased. Given that Triton X-100 ® changes its micelle structure according to its concentration in the solution, the corrosion rate of each concentration was tested.