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Ferroelectric tunnel junctions (FTJs) have attracted attention as devices for advanced memory applications owing to their high operating speed, low operating energy, and excellent scalability. In particular, hafnia ferroelectric materials are very promising because of their high remanent polarization (below 10 nm) and high compatibility with complementary metal-oxide-semiconductor (CMOS) processes. In this study, a Si-doped HfO2-based FTJ device with a metal-ferroelectric-insulator-semiconductor (MFIS) structure was proposed to maximize the tunneling electro-resistance (TER) effect. The potential barrier modulation effect under applied varying voltage was analyzed, and the possibility of its application as a non-volatile memory device was presented through stability assessments such as endurance and retention tests.

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