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A three-dimensional (3-D) vertical chain-cell-type phase-change memory (VCCPCM) for next-generation large-capacity storage was developed. The VCCPCM features formation of memory holes in multi-layered stacked gates by using a single mask and a memory array without a selection transistor. As a result of this configuration, the number of process steps for fabricating the VCCPCM is reduced. The excellent scalability of the VCCPCM's new phase-change material makes it possible to reduce the cell size beyond the scaling limit of flash memory. In addition, a poly-silicon selection diode makes it possible to reduce the cell factor to 4F 2 . Consequently, relative cost of the VCCPCM compared to 3-D flash memory is reduced to 0.2. IntroductionThe most important requirement for the storage-memory market is reduction of bit cost, and that requirement has been met by reducing the cell size of flash memory. However, high-voltage operation of flash memory makes it difficult to further reduce cell size. It has recently been reported that the bit-cost reduction can be continued by utilizing 3-D flash memory [1]. 3-D flash memory needs fewer process steps compared to simple stacking of flash memory, but reducing cell size is difficult for two reasons. Firstly, a 20-nm-thick ONO layer in the memory hole is needed and, secondly, a vertical poly-silicon selection MOS transistor needs a cell factor of 6F 2 [1]. In this work, a vertical chain-cell-type phase-change memory (VCCPCM), which can overcome these problems concerning 3-D flash in view of bit cost, is proposed. The key technologies of this VCCPCM are (1) a vertical chain cell for reducing the number of process steps, (2) a scalable new phase-change material for reducing cell size, and (3) a poly-Si XY-selection diode for reducing cell factor to 4F 2 . A poly-Si diode [2] and a lateral chain-cell-type PCM [3] were previously developed. Relative bit cost of both 3-D flash memory and VCCPCM is shown in Fig. 1. By virtue of technologies (1) to (3), the relative bit cost of the VCCPCM compared to 3-D flash memory is reduced to 0.2. Table 1 compares characteristics of 3-D flash memory and VCCPCM. In the present study, set, reset, and reading operations of the VCCPCM were confirmed. Moreover, off-current variation of the poly-Si diode was suppressed by short-time annealing.2. Device structure and operation method The structure of the VCCPCM is shown in Fig. 2. The poly-Si selection diode and VCCPCM are connected serially and positioned at the cross points between the bit and word lines. The structure and equivalent circuit of a VCCPCM are shown in Fig. 3. The gate oxide, channel poly-silicon, and the phase-change material are formed on the side of the holes in the stacked gates. Each memory cell consists of a poly-silicon transistor and a phase-change layer connected in parallel. The memory cells are connected serially in the vertical direction. In the set/reset operations, an off-voltage is applied to the gate at the selected cell, and a positive on-voltage is applied to the unselect...

The temperature dependence of Pt L III -and I K-edge extended x-ray-absorption fine-structure spectra of octahedrally coordinated Pt X 6 2Ϫ (XϭCl, Br, and I͒ complexes has experimentally been investigated not only for the first-nearest-neighbor ͑NN͒ shells but for higher NN ones. The second-and third-order cumulants of a radial distribution function in the octahedral system have been evaluated quantum mechanically by employing the interatomic potential including the third-order force constants. The experimentally obtained second-order cumulants agree with the values expected by the vibrational data and the third-order cumulants have successfully given the anharmonic force constants. Contribution of the bending motions to the cumulants of higher NN shells is discussed in detail.

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