SUMMARY Delamination in semiconductor plastic package is a cause of reliability degradation. We have tried to improve the adhesion strength between leadframe and epoxy resin. In this study, organic molecules–metal (Cu) complex “EC tag (Cu)” were employed. It is immobilized on the leadframe surface as adhesion promoter to adhere with thermosetting epoxy resin. In the results, immobilized EC tag (Cu) act as adhesion promoter that shows greater adhesion between leadframe and epoxy resin. Also, the leadframe with adhesion promoter doesn't affect semiconductor assembly characteristics.

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