Artificial intelligence and Internet of Things (IoT) technology, which are the core of the 4th industrial revolution, can resolve many problems that optimization of production times in the manufacturing process and reduction of materials required etc. In order to utilize the 4th industrial revolution technology, real-time monitoring technology of metal parts is essential, so technology for embedding sensors and IC chips into parts is essential. Using metal 3d printing technology, it is possible to embed IC chips into metal parts, which was impossible because of the existing high-temperature metal manufacturing process of casting or forging. Here we introduce a novel new method for sensor embedding into SUS316L by hemisphere design to avoid direct laser exposure onto sensors during selective laser melting process. Thermal and microstructural analysis was carried out to characterize the property of inner hemisphere for safe thermal couple embedding into SUS316L.

In the original publication of the article, the equally contribution statement was missed. The authors Min Sik Lee and Hayeol Kim should have been denoted as equally contributing authors.The original article has been corrected.Publisher's Note Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.