Multifunctional
phase change materials (PCMs) are highly desirable
for the thermal management of miniaturized and integrated electronic
devices. However, the development of flexible PCMs possessing heat
energy storage, shape memory, and adjustable electromagnetic interference
(EMI) shielding properties under complex conditions remains a challenge.
Herein, the multifunctional PCM composites were prepared by encapsulating
poly(ethylene glycol) (PEG) into porous MXene/silver nanowire (AgNW)
hybrid sponges by vacuum impregnation. Melamine foams (MFs) were chosen
as a template to coat with MXene/AgNW (MA) to construct a continuous
electrical/thermal conductive network. The MF@MA/PEG composites showed
a high latent heat (141.3 J/g), high dimension retention ratio (96.8%),
good electrical conductivity (75.3 S/m), and largely enhanced thermal
conductivity (2.6 times of MF/PEG). Moreover, by triggering the phase
change of the PEG, the sponges displayed a significant photoinduced
shape memory function with a high shape fixation ratio (∼100%)
and recovery ratio (∼100%). Interestingly, the EMI shielding
effectiveness (SE) can be adjusted from 12.4 to 30.5 dB by a facile
compression–recovery process based on shape memory properties.
Furthermore, a finite element simulation was conducted to emphasize
the advantage of the MF@MA/PEG composites in the thermal management
of chips. Such flexible PCM composites with high latent heat storage,
light-actuated shape memory, and adjustable EMI shielding functions
exhibit great potential as smart thermal management materials in military
and aerospace applications.
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