Waveguide bend is an indispensable component in the on-chip compact photonic integrated circuits (PICs) and the minimum bend size greatly limits the increase of integration density of PICs. Here, we propose broadband and low-loss silicon waveguide bend schemes using air trenches on both sides and embedded germanium arc in the inner side of waveguide bend. Using these ways, the silicon waveguide bending radius can be greatly reduced to less than 500 nm and the obtained insertion loss (IL) can be as low as 0.12 dB compared with IL = 1.73 dB obtained by direct silicon waveguide bend under the same bending radius. Meanwhile, the working bandwidth can be extended over 500 nm covering the whole optical communication band by keeping IL < 0.5 dB. Therefore, the proposed device schemes could push the development of on-chip PICs toward higher integration density.

High-performance and compact power splitters are fundamental components in on-chip photonic integrated circuits (PICs). We propose a silicon-based power splitter based on a subwavelength grating (SWG)-assisted multimode interference (MMI) structure. To shorten the device size and enhance the device performance, an inverse-tapered SWG is embedded in the central region of the MMI and two rows of uniform SWG are embedded on both sides, together with two right-angled cutting structures on the input side. According to the results, the MMI length was obviously reduced to 3.2 μm (5.2 μm for conventional MMI structure under the same waveguide width), while the insertion loss (IL) and reflection loss were 0.08 dB and <−35 dB, respectively. Moreover, the allowable working bandwidth could be extended to 560 nm by keeping IL <0.6 dB, covering the whole optical communication band. On the basis of these features, we believe that such a power splitter is very promising for building on-chip large-scale PICs where power splitting is indispensable.