No abstract

No abstract

No abstract

In this study, A2017-T4 aluminum alloy was plated with electroless NiP with different phosphorus content and rotary bending fatigue test was conducted to investigate the effect of hydrogen by plating on fatigue properties. The fatigue strength of the low-phosphorus type NiP plated specimen was higher than that of the untreated specimen, while that of the high-phosphorus type plated specimen was much lower. It is clear that the fatigue strength differs greatly depending on the phosphorus content in the plating film. The decrease in fatigue strength of the high phosphorus type plating specimen was attributed to hydrogen induced by plating from hydrogen analysis. Thus, despite the previous report that 2000 series aluminum alloys do not exhibit hydrogen embrittlement in slow strain rate tensile tests under wet condition, it was found that A2017-T4 aluminum alloy undergo hydrogen embrittlement when the alloy is plated with high-phosphorus type electroless NiP and fatiguetested on rotary bending machine.

PurposeTo report on research on the alternative surface finish “direct gold on copper”, including reaction mechanism, methods of deposition and end uses.Design/methodology/approachExamines the deposition reaction of the electroless flash gold plating bath, and the effects of the copper surface roughness and deposition time on the deposit and solderability characteristics.FindingsDirect immersion gold is only partially immersion and mostly electroless in deposition mode. The surface is applicable to soldering for both leaded solder and lead‐free solders. The surface is also wire bondable.Originality/valueThe paper offers details of a new alternative surface finish for use in printed circuit board fabrication as well as in packaging applications. The paper shows the electroless deposition mode of the process. The finish is ideally suited where Rf losses must be minimized. It is suitable for soldering as well as for wire bonding.