Electrochemical hydrogen evolution on (100)-oriented copper electrodes is shown to induce a novel surface reconstruction, which substantially influences the rates of this electrochemical reaction. As revealed by in situ video-STM the formation of this phase starts with lateral displacements of Cu surface atoms from lattice positions, resulting in stripe-like structures, followed by expansion of the surface lattice along the stripe direction.

The interface of Cu͑001͒ electrode surfaces in 10 mM HCl solution was studied by in situ surface x-ray diffraction and density functional theory, focusing on the precise structure of the c͑2 ϫ 2͒ Cl adlayer formed at positive potentials. Crystal truncation rod measurements in this adsorbate phase at a potential of −0.20 V Ag/AgCl reveal distinct differences to corresponding data by Tolentino et al. ͓Surf. Sci. 601, 2962 ͑2007͔͒ for the c͑2 ϫ 2͒ Cl structure formed at the Cu͑001͒-vacuum interface. Although in both environments, the atoms in the second Cu layer exhibit a small vertical corrugation, the sign of this corrugation is reversed. Furthermore, also the Cu-Cl bond distance and the average Cu interlayer spacings at the surface differ. Ab initio calculations performed for this adsorbate system reproduce these effects-specifically the reversal of the subsurface second-layer buckling caused in the presence of coadsorbed water molecules and cations in the outer part of the electrochemical double layer. In addition, studies at more negative potentials reveal a continuous surface phase transition to a disordered Cl adlayer at −0.62 V Ag/AgCl , but indicate a substantial Cl coverage even at the onset of hydrogen evolution.

The surface structure of Cu(100) electrodes in perchloric acid solutions of pH 1 to 3 was studied in the potential range of hydrogen evolution by video-rate scanning tunneling microscopy, focusing on the recently reported hydrogen-induced surface reconstruction [H. Matsushima et al., J. Am. Chem. Soc. 2009, 131, 10362]. Potential-dependent measurements reveal a two step formation process: at potentials close to the onset of hydrogen evolution a p(1×8) phase emerges, where Cu surface atoms in stripe-like structures are laterally and vertically displaced; at ≈30 mV more negative potentials a transition to a c(p×8) structure with an expanded Cu surface lattice occurs. Correlation of these observations with electrochemical data and studies on hydrogen interactions with Cu(100) surfaces under vacuum conditions support that these phases are induced by hydrogen in subsurface sites, pointing towards a high hydrogen coverage on this electrode surface under reaction conditions.

Dealloying is widely utilized but is a dangerous corrosion process as well. Here we report an atomistic picture of the initial stages of electrochemical dealloying of the model system Cu(3)Au (111). We illuminate the structural and chemical changes during the early stages of dissolution up to the critical potential, using a unique combination of advanced surface-analytical tools. Scanning tunneling microscopy images indicate an interlayer exchange of topmost surface atoms during initial dealloying, while scanning Auger-electron microscopy data clearly reveal that the surface is fully covered by a continuous Au-rich layer at an early stage. Initiating below this first layer a transformation from stacking-reversed toward substrate-oriented Au surface structures is observed close to the critical potential. We further use the observed structural transitions as a reference process to evaluate the mechanistic changes induced by a thiol-based model-inhibition layer applied to suppress surface diffusion. The initial ultrathin Au layer is stabilized with the intermediate island morphology completely suppressed, along an anodic shift of the breakdown potential. Thiol-modification induces a peculiar surface microstructure in the form of microcracks exhibiting a nanoporous core. On the basis of the presented atomic-scale observations, an interlayer exchange mechanism next to pure surface diffusion becomes obvious which may be controlling the layer thickness and its later change in orientation.

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