An analytic expression is developed to predict grain boundary void growth in bamboo interconnect under thermal residual stress field. The rate process is controlled by grain boundary and interconnect/passivation interface diffusions. The thermal residual stress field relaxes during void growth. Based on the present analysis, the behaviors of the void growth and the stress redistribution are characterized as a function of the microstructure of the interconnect, the state of the thermal residual stress, the initial size of the void, as well as the diffusivity ratio between the interface and the grain boundary.
In this paper we demonstrate that a plastically deformed zone around a stressed crack tip can be, mechanically, identified with an inclusion of transformation strain by means of Eshelby equivalent inclusion method. Thus, the shielding effect of the plastic zone can be quantitatively evaluated by the present transformation toughening theory. A closed-form solution to determine the change in the stress intensity factor induced by the plastic zone is given both for plane stress and plane strain mode I cracks under small-scale yielding conditions. By using the present solution, the effects of the strain-hardening behavior of the material, the plane stress and plane strain states and the T -stress on the crack-tip shielding effects are identified.
An analytical solution for prediction of the stress intensity factor (SIF) induced by plastically deformed zone at mode-II crack tip is presented under small scale yielding conditions. A significant shielding effect has been indicated, which is strongly affected by the strain-hardening behavior of the material, the applied stress and the T -stress.
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