In this work, a vertical gallium nitride (GaN)-based trench MOSFET on 4-inch free-standing GaN substrate is presented with threshold voltage of 3.15 V, specific on-resistance of 1.93 mΩ·cm2, breakdown voltage of 1306 V, and figure of merit of 0.88 GW/cm2. High-quality and stable MOS interface is obtained through two-step process, including simple acid cleaning and a following (NH4)2S passivation. Based on the calibration with experiment, the simulation results of physical model are consistent well with the experiment data in transfer, output, and breakdown characteristic curves, which demonstrate the validity of the simulation data obtained by Silvaco technology computer aided design (Silvaco TCAD). The mechanisms of on-state and breakdown are thoroughly studied using Silvaco TCAD physical model. The device parameters, including n−-GaN drift layer, p-GaN channel layer and gate dielectric layer, are systematically designed for optimization. This comprehensive analysis and optimization on the vertical GaN-based trench MOSFETs provide significant guide for vertical GaN-based high power applications.

Strain engineering has been reported to improve the optical and electrical properties of two-dimensional materials, and the adjustable bandgap of MoS2 has great application value in strain engineering. In this work, to explore the influence of the Si3N4 stress liner on the MoS2 photodetector, plasma enhanced chemical vapor deposition was used to deposit a 5 nm Si3N4 film on the surface of the device to introduce strain. The simulation results show that there is tensile strain in the MoS2 area under a Si3N4 layer, which can decrease the bandgap and electron effective mass of MoS2. The measurement results of the device show that the Si3N4 stress liner devices exhibit a higher light response than the Al2O3/MoS2/sapphire photodetector (control devices) under 365 and 460 nm laser illuminations. The maximum photocurrent (Iph) and responsivity (R) of the stress liner device under 365 nm illumination are 4.1 mA and 739.9 A/W, respectively, which are more than 30 times the corresponding value of the control device. Also, the maximum specific detectivity (D*) reached 2.5 × 1011 Jones, and the lowest noise equivalent power is 8.7 × 10−16 W/Hz1/2. Our work proved the feasibility of the Si3N4 stress liner to improve the performance of MoS2 photodetectors.

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