The theoretical analysis of corrective characteristics of three kinds of polishing methods for mid-frequency errors was studied, which was aimed to confirm the possibility that computer control optical surfacing and computer control activelap can be replaced by bonnet polishing in the machining process. The first step was to calculate the removal functions of three kinds of polishing technologies and use fast Fourier transform to figure out the frequency spectrum of each method. After that, according to the frequency spectra, curves of cut-off frequencies related to the working ranges of spatial frequencies errors were obtained. It revealed that the affected scope of spatial frequencies is determined by the polishing method, diameter size of polishing tool and shape of removal function. Moreover, only low-frequency errors could be modified and mid-frequency errors could not be corrected or created by computer control active-lap, and computer control optical surfacing can correct part of the mid-frequency errors and low-frequency errors in the polishing process, but at the same time can produce some new mid-frequency errors; as for bonnet polishing, it can be computer control active-lap-like in smoothing which only modified and created the low-frequency errors or computer control optical surfacing-like which corrected and created the mid-frequency errors in local polishing. Otherwise, the efficiency of bonnet polishing is higher than the other two methods. As a result, seen from the point of correction ability of mid-frequency or polishing efficiency, bonnet polishing could replace computer control active-lap and computer control optical surfacing for finishing two polishing stages by only one tool, which is significant to extending the application of bonnet polishing in optical manufacturing.

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A theoretical analysis for the effect mechanism of elliptic vibration assistance on the cutting of brittle materials is presented in this paper. The crack propagation in the chip formation zone in cutting of brittle materials is examined based on an analysis of the geometry and forces in the cutting region. The cutting model shows that the actual undeformed chip thickness is much decreased with elliptic vibration assistance, and the instantaneous rake angle of the cutting tool edge is also in a larger negative value than those in conventional cutting. These two conditions can ensure the compressive stress is much larger than the shear stress during the cutting process. Then the stress intensify factor is suppressed effectively and the shielding effect on the growth of pre-existing flaws is strengthened in the chip formation zone. The removal of brittle material tends to be in ductile mode without fracture. The characteristic examination of cutting force shows that the ratio of thrust force to cutting force with elliptic vibration is increased compared to that of conventional cutting. This can validate that the larger compressive stress can be generated in the chip formation zone with elliptic vibration assistance. The transition depth to brittle machining of silicon carbide with/without elliptic vibration assistance further supports the presented theory.

In view of the actual application of the status quo of the current digital campus universities, a unified campus authentication systems and solutions for the overall framework was proposed based on the introduction of Kerberos technology and LDAP protocol, in order to improve the utilization and security of campus resources.

Ultra precision grinding is currently the main technology for large scale advanced optical lens machining. In this paper, the machining system of ultra precision surface grinder is investigated. The experiments of new wedged aspheric lens with the dimension of 430*430mm have been conducted by SD600 diamond wheel, and the parallel grinding, cup truing and on-machine measuring are used for good accuracy. The results show the effective machining system and the problem for next research.