Ball shear testing is an efficient approach to investigate the mechanical reliability of solder joints at the structural level. In the present study, a series of low-speed ball shear tests were conducted to study the deformation and fracture characteristics of Sn96.5Ag3Cu0.5 solder joints at continuous speeds from 10 μm/s to 200 μm/s. In order to account for randomness, the quantity of tests was repeated for each shear rate. The relationship between mechanical properties and shear speeds was calculated in detail via effective statistical analysis. In addition, by utilizing SEM imaging and ingredient analysis the interfacial effect and fracture mechanism of solder balls were obtained and their fracture mode classified into two types, viz., bulk fracture and interface fracture. Furthermore, by means of statistical analysis and approximate calculation it was proven that bulk fracture balls have greater adhesive powers and reliability compared with interface fracture balls.

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