No abstract

In this study, metamorphic growth of GaAs on Si(001) substrate was investigated via three-step growth in a low-pressure metal organic chemical vapor deposition reactor. Three-step growth was achieved by simply inserting an intermediate temperature GaAs layer between the low temperature GaAs nucleation layer and the high temperature GaAs epilayer. Compared with conventional two-step growth, three-step growth could further reduce surface roughness and etch pit density. By combining three-step growth with thermal-cycle annealing, the authors have grown a 1.8-μm-thick GaAs epilayer with root mean square roughness of only 1.8 and 0.73 nm in 10 × 10 μm2 and 2 × 2 μm2 scanning areas, respectively. The threading dislocation density of the 1.8-μm-thick GaAs epilayer was as low as 1.1 × 107 cm−2, as calculated directly from the double crystal x-ray diffraction ω-scan full width at half maximum of the GaAs diffraction peak. The corresponding etch pit density was only 3 × 106 cm−2.

The growth mechanism of GaN epitaxial layers on mechanically exfoliated graphite is explained in detail based on classic nucleation theory. The number of defects on the graphite surface can be increased via O-plasma treatment, leading to increased nucleation density on the graphite surface. The addition of elemental Al can effectively improve the nucleation rate, which can promote the formation of dense nucleation layers and the lateral growth of GaN epitaxial layers. The surface morphologies of the nucleation layers, annealed layers and epitaxial layers were characterized by field-emission scanning electron microscopy, where the evolution of the surface morphology coincided with a 3D-to-2D growth mechanism. High-resolution transmission electron microscopy was used to characterize the microstructure of GaN. Fast Fourier transform diffraction patterns showed that cubic phase (zinc-blend structure) GaN grains were obtained using conventional GaN nucleation layers, while the hexagonal phase (wurtzite structure) GaN films were formed using AlGaN nucleation layers. Our work opens new avenues for using highly oriented pyrolytic graphite as a substrate to fabricate transferable optoelectronic devices.

The nominal internal quantum efficiency of InGaN/GaN multiple quantum wells significantly increases from 5.6 to 26.8%, as a low-temperature GaN cap layer is grown in N2/H2 mixture gas. Meanwhile, the room-temperature photoluminescence (PL) peak energy shows a merely 73 meV blue shift. On the basis of temperature-dependent PL characteristics analysis, the huge improvement in PL efficiency arises mainly from the “etching effect” of hydrogen, which reduces the defect density and indium segregation at the upper well/barrier interface, and consequently contributes to the decrease in the number of nonradiative recombination centers and the enhancement of carrier localization.

InGaN/GaN multiple quantum wells (MQWs) were grown with hydrogen treatment at well/barrier upper interface under different temperatures. Hydrogen treatment temperature greatly affects the characteristics of MQWs. Hydrogen treatment conducted at 850 °C improves surface and interface qualities of MQWs, as well as significantly enhances room temperature photoluminescence (PL) intensity. In contrast, the sample with hydrogen treatment at 730 °C shows no improvement, as compared with the reference sample without hydrogen treatment. On the basis of temperature-dependent PL characteristics analysis, it is concluded that hydrogen treatment at 850 °C is more effective in reducing defect-related non-radiative recombination centers in MQWs region, yet has little impact on carrier localization. Hence, hydrogen treatment temperature is crucial to improving the quality of InGaN/GaN MQWs.