Lanzhou is one of the largest and most important cities in the west part of China. Similar to other megacities in China, Lanzhou produces a lot of SFLs (Spent Fluorescent Lamps) each year too. SFLs in Lanzhou come from four sources: Industrial, commercial, municipal and residential. Consumers of fluorescent lamps have different concepts on how to manage SFLs well. These concepts are established based on their own social cultural norms, moral values and environmental awareness. Most of them are both ineffective and unscientific; SFLs are discarded regularly into trash and buried in landfills. So how to manage SFLs efficiently and effectively becomes a great challenge. So far, no professional companies can collect, dispose, and manage with SFLs well in Lanzhou area. It is necessary and urgent to establish management funds for collecting and disposing SFLs. This article has built a recycling management mode of SFLs, and has done some explanations on how to implement the model.
Plastic bag pollution is a growing global environmental concern. Several countries have recently approved bans on the use and distribution of plastic bags. In the USA, 22 of the 50 states have adopted multiple city/county ordinances. Most of these bans are introduced in coastal cities/counties. The local drivers, i.e. economy, geography, benefit, life-style, cost of living, and educational attainment, all impact the level and commitment to plastic bag bans. Currently, battles between support and opposition to these bans are typically financially driven; jobs and environmental health being main impact categories. This paper identifies several problems affecting the complete adoption of plastic bag bans in the USA, and gives some corresponding strategies to enhance the effectiveness and success of policy implementation.
In modern industry, the nondestructive testing of printed circuit board (PCB) can prevent effectively the system failure and is becoming more and more important. As a vital part of the PCB, the via connects the devices, the components and the wires and plays a very important role for the connection of the circuits. With the development of testing technology, the nondestructive testing of the via extends from two dimension to three dimension in recent years. This paper proposes a three dimensional detection algorithm using morphology method to test the via. The proposed algorithm takes full advantage of the three dimensional structure and shape information of the via. We have used the proposed method to detect via from PCB images with different size and quality, and found the detection performances to be very encouraging.
Based on stress distribution characteristics of pressure-dispersive ground anchor, a new construction equipment was developed for sub-expanding, thus the effective diameter of anchoring body was enlarged, the anchoring capacity was enhanced and the project cost was saved. With on site pull-out test of this type anchor, the study on anchoring mechanism and its application value showed that it could greatly improve the safety and reliability of the anchoring technology.
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