We report the formation of nanobubbles on graphene with a radius of the order of 1 nm, using ultralow energy implantation of noble gas ions (He, Ne, Ar) into graphene grown on a Pt(111) surface. We show that the universal scaling of the aspect ratio, which has previously been established for larger bubbles, breaks down when the bubble radius approaches 1 nm, resulting in much larger aspect ratios. Moreover, we observe that the bubble stability and aspect ratio depend on the substrate onto which the graphene is grown (bubbles are stable for Pt but not for Cu) and trapped element. We interpret these dependencies in terms of the atomic compressibility of the noble gas as well as of the adhesion energies between graphene, the substrate, and trapped atoms.
Ultralow-energy (ULE) ion implantation is increasingly being explored as a method to substitutionally dope graphene. However, complex implantation-related effects such as defect creation and surface contamination, and how they can be minimized by thermal annealing, remain poorly understood. Here, we address these open questions taking as the model case epitaxial graphene grown on Cu(111), which was subsequently ULE implanted with Mn at 40 eV and then studied as a function of annealing temperature under ultrahigh vacuum. While significant surface cleaning occurs at annealing temperatures as low as 200 °C, recovery from the implantation-induced disorder requires at least 525 °C. Upon high-temperature annealing, in the 600−700 °C range, the Mn atoms that were incorporated upon implantation as intercalated species (between graphene and the Cu surface) experience diffusion into the Cu layer, creating a subsurface alloy. Annealing at 700 °C restored implanted graphene to a nearly pristine state, with a well-ordered graphene lattice with substitutional Mn atoms and a well-defined Dirac cone. In addition to the insight into the complex physicochemical effects induced by thermal annealing, our results provide useful guidelines for future experimental studies on graphene that is modified (e.g., substitutionally doped) by using ULE ion implantation.
In this paper, the effectiveness of ultra-low-energy ion implantation as a means of defect engineering in graphene was explored through the measurement of Scanning Kelvin Probe Microscopy (SKPM) and Raman spectroscopy, with boron (B) and helium (He) ions being implanted into monolayer graphene samples. We used electrostatic masks to create a doped and non-doped region in one single implantation step. For verification we measured the surface potential profile along the sample and proved the feasibility of lateral controllable doping. In another experiment, a voltage gradient was applied across the graphene layer in order to implant helium at different energies and thus perform an ion-energy-dependent investigation of the implantation damage of the graphene. For this purpose Raman measurements were performed, which show the different damage due to the various ion energies. Finally, ion implantation simulations were conducted to evaluate damage formation.
Cluster beam deposition is employed for fabricating well-defined bimetallic plasmonic photocatalysts to enhance their activity while facilitating a more fundamental understanding of their properties. AuxAg1-x clusters with compositions (x =...
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