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In this study, bilayer thin films with different layers' order, Ni/Ti/Si (100) and Ti/Ni/Si (100), are prepared by magnetron sputtering at room temperature followed by the thermal annealing in a vacuum in the temperature range from 400°C to 600°C for 1 h. The combination of XRD and SIMS techniques is used to investigate the effect of the layers' inverse arrangement on the crystalline structure, phase formation and elemental composition upon thermal treatment. As revealed, the annealing of the Ni/Ti bilayer leads to the diffusion of Ti atoms through the Ni grain boundaries towards the outer surface. For the case of Ti/Ni bilayer, interdiffusion between Ni and Ti is not detected upon heat treatment, whereas the thermally induced diffusion between Ni and substrate resulted in the formation of NiSi silicides is revealed. The likely structural and thermodynamic reasons for such behaviour are discussed.

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In this study, a microtribological characteristics of Ni(25 nm)/Cu(25 nm)/ Cr(25 nm) three-layer thin films fabricated using DC magnetron sputtering are explored using progressive scratch test. Four various types of thin films are examined and compared: as-deposited film, film after low-energy Ar + ion irradiation, film annealed at 450°С for 15 minutes in vacuum, and film after ion irradiation followed by vacuum annealing. Scratch tests are supplemented by structural (XRD) and chemical (AES) experimental studies. As figured out, the sample after ion irradiation followed by annealing demonstrated the best microtribological and wear resistance characteristics among all studied films. The highest scratch resistance, smooth scratch shape, the lowest value of peak tangential force as well as the absence of side cracks and film delamination are revealed for the sample after irradiation followed by annealing. The likely reasons of this behaviour are discussed.