Electro-deposition technique is capable of producing nano-gralned bulk copper specimens that exhibit superplastic extensibility at room temperature. Metals of such small grain sizes deform by grains sliding, with little distortion occurring in the grain cores. Accommodation mechanisms such as grain boundary diffusion, sliding and grain rotation control the kinetics of the process. Actual deformation minimizes the plastic dissipation and stored strain energy for representative steps of grain neighbor switching. Numerical simulations based on these principles are discussed in this paper.