This paper simulates reactive magnetron-sputtering in constant current mode in a Vanadium-O 2 /Ar system equipped with a DC power supply by adopting both kinetics model and Berg's model. The target voltage during the reactive sputtering has been investigated as a function of reactive gas flow. Both experiments and simulations demonstrate a hysteresis curve with respect to the oxygen supply. The time-dependent variation of the target mode is studied by measuring the target voltage for various reactive oxygen gas flows and pre-sputtering times. The presputtering time increases with the increased initial target voltage. Furthermore, a corresponding time-dependent model simulating target voltage changes is also proposed. Based on these simulations, we find some relationships between the discharge voltage behaviour and the properties of the formed oxide. In this way, a better understanding of the target voltage changes during reactive sputtering can be achieved. We conclude that the presented theoretical models for parameter-dependent case and time-dependent case are in qualitative agreement with the experimental results and can be used to comprehend the target voltage behaviour in the deposition of vanadium oxide thin films.

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Carrier concentration and mobility of materials are key factors affecting device performance. Hall tests at different temperatures demonstrate that the carrier concentration and mobility in impurity-doped AlGaN decrease with temperature decreasing. However, carrier concentration and mobility obtained by polarization-induced doping are independent of temperature. Using quasi-insulating GaN as substrate, the electron concentration obtained in the linearly graded AlGaN film through impurity-doping is only 10-17 cm-3 or less. In this study, using unintentional impurity doped (n-type, 10-16 cm-3) GaN template, graded AlGaN film is grown by molecular beam epitaxial, in which polarization induced ultra-high electron concentration is up to 1020 cm-3 in graded AlGaN film without using any dopant. Using quasi-insulating GaN as substrate, only the surface of the free electrons serves as polarization dopant, while unintentionally doped GaN template is used as a substrate, in addition to free electrons on surface/interface, it is also reasonable to surmise more negative charges attracted by polarization electric field to be the source of polarization doping, in the unintentional doped GaN template, thereby achieving an ultra-high carrier concentration via polarization induced n-type doping.

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