1.4 µm-Thick Transparent Radio Frequency Transmission Lines Based on Instant Fusion of Polyethylene Terephthalate Through Surface of Ag Nanowires

Fabrication and Characterization of a Capacitive Photodetector Comprising a ZnS/Cu Particle/Poly(vinyl butyral) Composite

“…Since the strain formed on the surface of a film is equal to its thickness divided by twice the bending radius, the lack of a separate substrate originating from the free-standing nature of the composite greatly contributed to the mechanical stability of the resulting device during bending sequences. 24 After cross-linking, another layer of AgNWs was formed on the opposite side of the composite to afford a complete sandwich structure comprising two AgNW layers and a ZnS/Cu−PVB composite layer. When the completed structure was peeled off from the glass support, the AgNW layer on the bottom side of the composite (initially deposited on glass) was expected to be fully embedded just underneath the composite surface.…”

“…PVB was selected as a polymer matrix in view of its high transparency, optical clarity, strong binding ability, flexibility, and good adhesion to a wide range of surfaces. − Furthermore, PVB exhibited a free-standing nature after sufficient cross-linking with HDI, which implied that the ZnS/Cu–PVB composite did not need any support such as glass or other polymeric films after cross-linkage formation. Since the strain formed on the surface of a film is equal to its thickness divided by twice the bending radius, the lack of a separate substrate originating from the free-standing nature of the composite greatly contributed to the mechanical stability of the resulting device during bending sequences . After cross-linking, another layer of AgNWs was formed on the opposite side of the composite to afford a complete sandwich structure comprising two AgNW layers and a ZnS/Cu–PVB composite layer.…”

“…However, the mechanical stability of the electrode applied to the opposite side of the composite was a subject of concern since the nanowires were simply placed on the composite surface without any chemical interaction and no stable bond formation between the two materials could therefore be expected. Herein, we employed photoinduced heating using an IPL system to resolve this issue in view of the well-known ability of IPL irradiation to dramatically increase the temperature of AgNWs and the nearby region, in line with the propensity of nanoscale metallic structures to generate heat under optical illumination. , Notably, the above ability is strongly enhanced by plasmon resonance when the frequency of incident light matches that of the collective resonance of the fabricated nanostructures, ,, which allows one to very rapidly increase the temperature of AgNWs and stimulate a wide range of physical processes and chemical reactions with unprecedented spatial and temporal control. , The most noteworthy aspect of this type of heating with subsequent cooling is that it is very rapid and selective, which implies that areas located far from NWs remain unheated and is particularly important in view of the fact that heating may damage other device constituents. Therefore, this approach was expected to result in the incorporation of top-side AgNWs into the composite surface.…”

Optically Transparent and Flexible Radio Frequency Electronics through Printing Technologies

“…Another example is a transparent frequency selective surface (FSS), which is a periodic structure for selectively shielding from unwanted frequency bands while allowing the bands of interest to pass through. [ 12–17 ] Other examples of transparent RF electronics include RF circuits, [ 18 ] EM absorbers, [ 19–21 ] RF shielding, [ 22–25 ] and RF energy harvesting. [ 26,27 ]…”

“…Printed electronics (PE), as the name suggests, are electronic devices manufactured using traditional printing technologies. Compared with conventional fabrication techniques, such as milling, photolithography, and etching, [ 11,18,20,28,29 ] printing has many merits that make it suitable for the subsequent generations of electronics, such as ease of mass production with simple procedures, lower costs, higher throughput, and the ability to work with flexible materials and substrates. PE technologies allow for the direct deposition of various materials, including conductors, semiconductors, and dielectrics, among others, on different flexible substrates to form 2D and 3D patterns.…”