10.3 A 0.12mm² Wien-Bridge Temperature Sensor with 0.1°C (3σ) Inaccuracy from -40°C to 180°C

3.4 A 16MHz CMOS RC Frequency Reference with ±400ppm Inaccuracy from −45°C to 85°C After Digital Linear Temperature Compensation

“…As shown in Fig. 1, it consists of a frequency-locked loop (FLL), which locks the frequency fDCO of a digitally-controlled oscillator (DCO) to the phase-shift of a Wien bridge (WB) RC filter [6]. The temperature dependence of the WB is compensated by information provided by a Wheatstone bridge (WhB) temperature sensor [7].…”

“…This choice ensures that the accuracy of the frequency reference only depends on the spread of two types of resistors. The phase-shift of the WB (ΦWB) is digitized by a 2 nd -order Phase Domain ΔΣ-Modulator (PDΔΣM) [6]. As shown in Fig.…”

A BJT-Based Temperature-to-Digital Converter With a ±0.25 °C 3$\sigma$ -Inaccuracy From −40 °C to +180 °C Using Heater-Assisted Voltage Calibration

“…Thermal diffusivity (TD) sensors [8], and resistor-based sensors [9] have also demonstrated good accuracy at high temperatures. Compared to BJT-based sensors, however, the milliwatt-level power dissipation of TD sensors, and the 2point calibration required by precision resistor-based TDCs makes them less suitable for automotive applications.…”

Under-FET Thermal Sensor Enabling Smart Full-Chip Run-Time Thermal Management

“…This is particularly true to modern ICs in advanced technologies, such as FD-SOI and FinFET, where the aggressively scaled feature sizes and higher integration density, in combination of rapidly increased chip complexity, clock frequency and data rate and power density, as well as deterioration in thermal conduction due to insulating dielectrics, together nonlinearly accelerates the self-heating induced thermal problems at chip level. Over years, significant efforts have been devoted to develop various on-chip thermal sensing and management techniques [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16]. Many thermal sensors have been reported including thermistor, thermocouple, BJT and diode, as well as CMOS circuit blocks [4][5][6][7][8][9][10][11][12][13][14][15][16].…”

“…Over years, significant efforts have been devoted to develop various on-chip thermal sensing and management techniques [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16]. Many thermal sensors have been reported including thermistor, thermocouple, BJT and diode, as well as CMOS circuit blocks [4][5][6][7][8][9][10][11][12][13][14][15][16]. While various new sensors were reported to improve thermal sensitivity itself, one critical challenge remains, which is how to realize fine spatial temperature sensing resolution down to single transistor level on a large and complex IC chip that is essential to pin-pointing the self-heating sources (hot spots), in-operando, within a transistor, and hence being able to practically achieve run-time full-chip smart thermal management in real-world applications.…”