2017 Symposium on VLSI Technology 2017
DOI: 10.23919/vlsit.2017.7998203
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10nm high performance mobile SoC design and technology co-developed for performance, power, and area scaling

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Cited by 13 publications
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“…The transceiver achieved the bandwidth density of 180 Gb/s/mm 2 with 10% of the effective area occupied by photonics, which can be reduced to 5% by optimizing the floorplan. Incorporating this photonics platform in advanced sub-10 nm technology nodes with higher transistor densities 33 This caused dielectric residues on the wafer after photonic trench planarization. We also experienced metal residues after the fabrication of the first via contact.…”
mentioning
confidence: 99%
“…The transceiver achieved the bandwidth density of 180 Gb/s/mm 2 with 10% of the effective area occupied by photonics, which can be reduced to 5% by optimizing the floorplan. Incorporating this photonics platform in advanced sub-10 nm technology nodes with higher transistor densities 33 This caused dielectric residues on the wafer after photonic trench planarization. We also experienced metal residues after the fabrication of the first via contact.…”
mentioning
confidence: 99%
“…Si fin-shaped field-effect transistors (FinFETs) have been scaled down to 10-nm node through higher aspect ratio and layout optimization [1]. FinFETs started to substitute planar MOSFETs through design-technology co-optimization in terms of performance, power, and area for system-on-chip applications [2]. However, there are several technical concerns to be considered for further scaling.…”
Section: Introductionmentioning
confidence: 99%