140 GHz Differential Antennas in Embedded Wafer Level Ball Grid Array Technology

Bhutani, Akanksha; Bekker, Elizabeth; Li, Teng; Oliveira, Lucas Giroto de; Zwick, Thomas

doi:10.23919/eumc50147.2022.9784312

Cited by 5 publications

(3 citation statements)

References 10 publications

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“…To date, the antennas in [10] have the highest bandwidth of eWLB antennas, above 100 GHz. Regarding wideband antennas centered around 140 GHz, a single-ended corner patch element from [11] and results for a dipole, bow-tie, and rhombic differential antenna [12] have been published. The round SRR antenna from [13] and the differential, square SRR (SSRR) antenna from [14] are significant contributions in this area.…”

Section: Aip In Ewlbmentioning

confidence: 99%

“…balun) transition is required when measuring differential antennas. A Chebyshev quarter-wave stepped balun transformer is used for the 50 Ω CPW to 100 Ω CPS transition -previously characterized in [12]. This balun necessitates bond wires to bridge the finite ground planes.…”

Section: Esrr Antennamentioning

confidence: 99%

“…Furthermore, measurements of the bond wires after manufacturing indicated that the loop profile of the wire bonds can differ from the simulation in terms of loop height, loop profile and the tail length. The balun performance is strongly dependent on the bond wire construction [12]. As aforementioned, the BGA height, and the antenna-to-reflector distance, can vary by up to 30 𝜇m [11] -this will in turn influence the radiation patterns; the peak gain could vary with up to approximately 0.6 dB.…”

Section: Esrr Antennamentioning

confidence: 99%

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Broadband packaging solution in embedded wafer level ball grid array technology for D-band PMCW radar

Bekker,

Gramlich,

Valenziano

et al. 2024

Int. J. Microw. Wireless Technol.

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A system-in-package for a wideband digital radar, in D-band, requires broadband, high-gain antennas combined with broadband chip-to-package and package-to-printed circuit board (PCB) interconnects. This paper demonstrates a wideband, low-loss quasi-coaxial signal transition, and a novel electric split ring resonator (eSRR)-based antenna-in-package (AiP) with a modified reflector concept, for improved gain, in embedded wafer level ball grid array (eWLB) technology. A complete chip-to-package-to-PCB interconnect is also demonstrated by combining the quasi-coaxial transition with a chip-to-package interconnect. The quasi-coaxial signal transition has the largest impedance bandwidth among ball grid array-based quasi-coaxial signal transitions. For the modified reflector concept, a horn-shaped cavity is micromachined in the PCB substrate and remetallized with aerosol-jet printing, placing the reflector 0.25λ from the antenna. The antenna gain is improved with up to 5.3 dB. The AiP with the horn-shaped reflector is the single element with the highest gain, in eWLB technology, above 100 GHz.

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