1511 Effect of Copper Wire Location and Voids on Evaluation of Interface Crack between Solder Ball and Copper by Direct Current Potential Difference Method

Nakahara, Ryoichi; Yoshida, Naoto; Tada, Naoya

doi:10.1299/jsmecmd.2009.22.724

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“…The defects in solder bumps can be classified as cracks [4], voids [5], foreign substances [6], disconnections, or short circuits (bridges) [7]. Cracks, voids, and foreign substances cannot be detected in an electrical continuity test.…”

Section: Introductionmentioning

confidence: 99%

A study of using nonnegative matrix factorization to detect solder-voids from radiographic images of solder

Mouri

Kato

Yasuda

et al. 2014

2014 IEEE 23rd International Symposium on Industrial Electronics (ISIE)

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Accurate detection of voids in solder bumps on ball grid arrays (BGAs) is important for improving device quality.Radiographic imaging is commonly used to inspect BGA packages incorporate into LSI circuits. In the case of conventional method, imaging is normally done four times, and the images obtained are averaged to reduce noises. We have developed a nonnegative matrix factorization method for detecting solder-voids using only three radiographic images. Computer simulation demonstrated that it has the same level of accuracy as the conventional method.

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Section: Introductionmentioning

confidence: 99%