“…The use of polymer substrates with 250 1CoT M o350 1C appears more attractive for several reasons: (i) it is possible to use many of the conventional processes adopted for LTPS TFT fabrication with minor modifications; (ii) key materials, such as dielectrics, which are fundamentally poorer at low temperatures ( o250 1C), show adequate performance in the T-range 250-350 1C; (iii) ULTPS TFT performance are generally inferior to those fabricated at T4250 1C, as key fabrication steps, such as device hydrogenation, are problematic at very low temperatures [8]. Therefore, more recent activities have focused on the use of PAR [8,17] and PI [8,[26][27][28][29][30][31][32][33] and devices with performance comparable to those fabricated on glass have been demonstrated, with field effect mobility for n-channel devices up to 370 cm 2 /Vs [33] and for p-channel devices up to 124 cm 2 /Vs [31]. In the next sections we will describe in some detail the main steps for the direct fabrication of polysilicon TFTs on polymer substrates, including the process we developed on ultra-thin PI, the electrical characteristics of the devices fabricated on polymer substrates and some of the issues and, finally, the applications.…”