18‐1: <i>Invited Paper:</i> Evaluating In‐Process Test Compatibility of Proposed Mass‐Transfer Technologies to Achieve Efficient, High‐Yield MicroLED Mass‐Production

Henley, Francois J.

doi:10.1002/sdtp.12898

Cited by 7 publications

(6 citation statements)

References 2 publications

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“…Across the four individual dies, all 800 pixels exhibited PL after the dry‐etching step. This does not mean that PL imaging is predicting 100 % yield but instead is an ineffective predictor of dry‐etching‐related defects as first reported by Tesoro Scientific 22,23 . This is further supported by CL and EL results discussed next that show lesser yields.…”

Section: Resultssupporting

confidence: 63%

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Early defect identification for micro light‐emitting diode displays via photoluminescent and cathodoluminescent imaging

et al. 2021

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Ultrahigh‐resolution micro light‐emitting diode (LED) displays are emerging as a viable technology for self‐emissive displays. Several of the critical issues facing micro LED displays with millions of pixels are fidelity, process control, and defect analysis during LED fabrication and transfer. Here, we investigate two non‐destructive test methods, photoluminescent and cathodoluminescent imaging, and compare them with electroluminescent images to verify LED fidelity and evaluate these methods as potential tools for defect analysis. We show that utilizing cathodoluminescent imaging as an analysis tool provides a rich data set that can identify and categorize common defects during micro LED display fabrication that correspond to electroluminescence. Photoluminescent imaging, however, is not an effective method for fidelity analysis but does provide information on dry‐etching uniformity.

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Section: Resultssupporting

confidence: 63%

“…Defects in the wiring or interconnects can also cause inactive pixels. For many of these defects, the primary method of defect analysis is electroluminescent (EL) imaging and optical quality assurance checks 22,23 . Unfortunately, this cannot be performed until the display is fully assembled and then must be either discarded or repaired.…”

Section: Introductionmentioning

confidence: 99%

Early defect identification for micro light‐emitting diode displays via photoluminescent and cathodoluminescent imaging

et al. 2021

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“…Today, no satisfying massively parallel, high throughput, contactless, on-wafer testing processes and equipment are available. Companies such as Tesoro Scientific, which was acquired by Apple in 2020, have been working on such process [4] . More recently, various organizations have suggested using cathodoluminescence [5] or Raman spectroscopy.…”

Section: -1 / E H Virey Invited Papermentioning

confidence: 99%

59‐1: Invited Paper: From Lab to Fab: Challenges and Requirements for High‐Volume MicroLED Manufacturing Equipment

Virey

Bouhamri

2021

Symp Digest of Tech Papers

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Availability of standard, high volume production tools and processes enabled the commercialization and commoditization of LCD and OLED. For microLED, the lack of processes standards and the proliferation of technology paths hinders the development of high‐volume manufacturing tools. This paper discusses the challenges for equipment manufacturers attempting to capture the microLED opportunity. While various technology bottlenecks remain, the microLED display industry can leverage on existing expertise and equipment from the display, semiconductor, LED and photonic industries to accelerate industrialization.

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“…This is evidenced by the fact that many companies are investing on the development of laser-based processing equipment for large-scale Micro-LED production, such as Coherent, Toray, ASM, Uniqarta, QMAT and Tesoro Scientifc. [52,66,67] Significant progress in laser equipment for Micro-LED has been achieved.…”

Section: Introductionmentioning

confidence: 99%

Laser‐Based Micro/Nano‐Processing Techniques for Microscale LEDs and Full‐Color Displays

Gong

2022

Adv Materials Technologies

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Micro light‐emitting diode (Micro‐LED) display is an emerging display technology thanks to its high brightness, fast switching speed, and low power consumption. The commercialization of this technique is being explored by developing advanced processing techniques on an industrial scale. Recent ground‐breaking advances in the manufacture of Micro‐LEDs are mainly based on powerful laser micro/nano‐processing techniques with the unique ability to fabricate materials, structures and devices with the advantages of non‐contacting processing, high efficiency, adjustable coverage from micro‐ to macroscale and the compatibility with organic and inorganic materials. This paper categorizes, reviews and analyzes the main challenges and technical solutions in the Micro‐LED displays by various laser manufacturing processes, covering chip dicing, geometry shaping, laser annealing, laser lift‐off (LLO), laser‐based Micro‐LED transfer, laser‐assist bonding (LAB) and laser repair. The fundamental principles of these techniques are discussed along with their basic mechanisms, followed by an exploration of the latest progress in the field. Finally, a detailed analysis of the advantages and disadvantages of these techniques is given, and the future research directions of laser techniques in Micro‐LED display are discussed.

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18‐1: Invited Paper: Evaluating In‐Process Test Compatibility of Proposed Mass‐Transfer Technologies to Achieve Efficient, High‐Yield MicroLED Mass‐Production

Cited by 7 publications

References 2 publications

Early defect identification for micro light‐emitting diode displays via photoluminescent and cathodoluminescent imaging

Early defect identification for micro light‐emitting diode displays via photoluminescent and cathodoluminescent imaging

59‐1: Invited Paper: From Lab to Fab: Challenges and Requirements for High‐Volume MicroLED Manufacturing Equipment

Laser‐Based Micro/Nano‐Processing Techniques for Microscale LEDs and Full‐Color Displays

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