Abstract:Abstract-This paper presents a two-stage power amplifier MMIC using a 0.4 μm GaN-HEMT process. The two-stage structure provides high gain and compact circuit size using an integrated inter-stage matching network. The size and loss of the inter-stage matching network can be reduced by including bond wires as part of the matching network. The two-stage power amplifier MMIC was fabricated with a chip size of 2.0×1.9 mm 2 and was mounted on a 4×4 QFN carrier for evaluation. Using a downlink LTE signal with a PAPR … Show more
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